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Spire RackSper III - 9R272B1H3
Spire is proud of the successful release of the RackSper III. This 1U All copper active cooler solution has been a proven success over the years.
Standardized to fit any mainboard by simply placing the RackSper III into the supporter bracket this coolers is a cost effective and easy to assemble solution for the socket 478 micro-processors from Intel.
Supplied with SP-420 Thermal Grease interface material and 2 metal installation clips the RackSper III is the best 1U Soc.478 solution on the market today!
* Pure copper heat-sink
* Low profile - 1U
* 70x15mm powerful DC Fan
Socket 478 Cooling kit
Dimensions Heat sink : 83×60×16 mm (l × w × h)
12VDC Fan : 60×60×10 mm
Bearing Ball bearing
Rated speed 4800 RPM +/-10%
Rated power 3.36 W
Noise level 29 dBA
Air flow 22.21 CFM at 4800 RPM +/-10%
Current 0.28 A
Life hours Ball: 50.000
Features All copper heatsink, low profile
Connector 3 pin, mainboard
Application No applications defined
Thermal resistance 0.43 °C/W
Thermal type Stars-420 white grease (Injection tube)
*All Spire CPU cooling products come with thermal compound either pre-applied onto the cooler or in an injection tube. Compound will begin to function at its optimum potential, after a gradual increase in heat-dissipation, approximately 168 hours (7days) after initial application.
Installation View Installation Procedure (from Spire)
* All technical data shown above are measurements from our own laboratory. Product images shown may differ from actual product. Specifications are subject to change without prior notice.