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Spire VertiCool III SP604B3-C Socket 754 / 940 / 775 / 939 Cooling kit

Item Number: 840556063520-Price: $44.95Sale: $41.95
Spire VertiCool III SP604B3-C  Socket 754 / 940 / 775 / 939 Cooling kit
Spire VertiCool III SP604B3-C  Socket 754 / 940 / 775 / 939 Cooling kit Spire VertiCool III SP604B3-C  Socket 754 / 940 / 775 / 939 Cooling kit

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Spire VertiCool III SP604B3-C

The VertiCool III has inherited the unique features from its counterpart, VertiCool II and much more! Features include: thermally improved heat-pipes that allow faster heat distribution, a 90mm center-position fans providing more air flow in and out of the heat sink and of course it is fully compatible with both Intel socket 775 and AMD K8 series CPU!


Main Features:

  • All Copper High-density Tower Heat Sink
  • 4 thermally improved copper heat-pipes
  • Ball bearing 90mm fan
  • Silent; Manually controlled PCI Fan Control
  • Universal Clip for 775 and K8 sockets
  • Rubber-Screw Fan vibration absorption; 4 rubber screws to hold and absorb any fan vibration

Socket 754 / 940 / 775 / 939 Cooling kit

Dimensions
Heat sink :       93×93×126 mm (l × w × h)
12VDC Fan : 92×92×25 mm
Bearing Ball bearing
Rated speed 2000 - 3500 RPM +/-10%
Rated power 2.40 - 4.80 W
Noise level 19.0 - 26.0 dBA
Air flow 36.8 - 58.21 CFM
Current 0.20 - 0.40 A
Life hours Ball: 50.000
Features Universal 775 & K8
4 Thermally Improved Heat-pipes
All copper tower Heat-sink
Connector 3 Pin, mainboard
   
Application
Intel :  Celeron D ~ 2.93 GHz (340J)
Core Duo ~ 2.33 GHz (775 Dual-core)
Pentium 4 ~ 3.73 GHz (775 Prescott)
Pentium D ~ 3.4 GHz (775 Dual-Core)
Pentium EE ~ 3.73 GHz (775 Dual-Core)
AMD :  Athlon 64 ~ 4800+ (K8)
Athlon 64 FX-51 (K8)
Athlon 64 FX-53 (K8)
Athlon 64 FX-55 (K8)
Athlon 64 FX-57 (K8)
Athlon 64 FX-60 (K8)
Opteron ~ 2.6 (K8)
Sempron ~ 3300+ (K8)
Thermal resistance 0.23 °C/W
Thermal type Stars-420 white grease(Injection Tube,0.5g)
*All Spire CPU cooling products come with thermal compound either pre-applied onto the cooler or in an injection tube. Compound will begin to function at its optimum potential, after a gradual increase in heat-dissipation, approximately 168 hours (7days) after initial application.






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